FC300
The FC300 High Precision Die / Flip Chip Bonder is the newest generation of high accuracy and high force system for chip-to-chip and chip-to-wafer bonding, on wafers up to 300 mm. The tool features automated handling of chips and substrates up to 100 mm from waffle packs, plus a robotic option enabling chip picking from diced wafer and automated handling of larger substrate. It features also Nanoimprinting Lithography (NIL) capabilities.
With a quick process head reconfiguration, the FC300 platform performs multiple applications including:
High Force, particularly interesting for Cu-Cu bonding as used in 3D-IC packaging, or Nanoimprinting using a Hot Embossing Lithography process;
Low Force Reflow Bonding for imaging devices, RF, or Optoelectronics assembly;
UV-Curing for Adhesive Bonding or for Nanoimprinting using a UV-NIL process.
Key Benefits
± 0.5 µm post-bonding accuracy and 20 µradians leveling guarantee highest quality for the most advanced products Semi-Open Confinement Chamber for Oxide Reduction (option) Bonding of devices up to 100 x 100 mm onto wafer up to 300 mm to enable large format assemblies NIL configuration as add-on to bonding capability for maximum flexibility Air bearing construction on a granite structure ensures long-term stability and reliability Optional integrated chamber for gang reflow in a gas or vacuum environment
Process Capabilities
Die Bonding (Face Up) Flip Chip Bonding (Face to Face) Mass Reflow, In-Situ Reflow, Fluxless Eutectic Bonding Thermocompression Bonding, Ultrasonic Bonding UV-Curing Bonding, Adhesive Bonding UV-NIL, Hot Embossing Lithography
Applications
Chip-to-Chip, Chip-to-Wafer Bonding
3D Interconnect, Chip Stacking, Heterogeneous Integration
Optoelectronicss and Photonic Device Assembly
MOEMS, MEMS, MCM
Nanoimprint Applications: Optics, Microfluidics, etc...