ACCµRA100
The ACCµRA100 is a semi-automatic flip-chip bonder that guarantees +/- 0.5 µm post-bonding accuracy.
Its flexibility makes it ideal for developing a wide range of applications.
The ACCµRA100 combines high precision, accessibility and cost-effectiveness.
It is the perfect equipment for universities and R&D institutes.
Key Benefits
- Small footprint
- Easy to use
- Quick Set-Up
- R&D oriented
- High Force
Process Capabilities
- Thermocompression
- Reflow
- UV Curing
- Au, Au/Sn, In, Cu, Cu/Sn
- Adhesives
- Thermosonic
Applications
- Flip-Chip, Die attach
- C2C, C2S
- Laser Bars and VECSEL
- MEMS, MOEMS, MCM
- 3D Packaging
- Nanoimprinting