Title: Evaluation of Cu/Sn-Cu Bump Bonding Processes for 3D Integration using a Fluxing Adhesive.

Abstract:
 We present the results of a study to evaluate the use of a fluxing adhesive developed by LORD Corp. in the bonding of Cu/Sn-Cu bump structures for interconnection in 3D integration structures. Using an area-array daisy chain test vehicle with a bump pitch of 25 µm, samples are prepared using our standard bonding methodology and with the fluxing adhesive and then evaluated through electrical measurements and cross section SEM analysis. The results show that the use of the fluxing underfill material results in a well-formed bond between the Cu and Cu/Sn bumps and encapsulates the interconnects to provide environmental protection and additional mechanical strength to the interconnect array.

Courtesy of RTI International: Plated 15 µm diameter Cu/Sn bumps		Any questions? info@set-sas.fr    Download the entire article*! *This material, presented at the IMAPS International Conference on Device Packaging (March 8-11, 2010), is posted here with permission of IMAPS.  FC150

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