Technical Paper

Title: Multi-usable, adhesively bonded UV-NIL templates.

Introduction: Since the mid 1990s many efforts were put into improvement of nanoimprinting. The main improvements comprised imprint tooling and resist systems. Besides the use in microelectronics lithography, nanoimprinting is also very promising as a MEMS technology. MEMS have highly different requirements compared to microelectronic applications and even higher demands on cost reduction. Nanoimprinting is seen as a cost effective technology for resolutions beyond 50 nm and is thus per se very attractive for MEMS research and industry. Nanoimprint templates are a major cost factor, especially for prototyping and technology development. Reduced template costs are therefore highly desired. This work focuses on multi-usable, bonded UV-NIL imprint templates as a cost efficient alternative to monolithic quartz templates. Bonded templates use a base substrate (e.g. 6.35 mm mask blank) and a structured quartz wafer chip attached to the base substrate. Cost reduction comes from wafer scale processing of the single quartz chips. Most important for bonded templates is a strong bonding between the structured chip and the base substrate, a high planarity between chip and substrate, a high optical transparency in the UV spectrum, and most important a high chemical and aging resistance to enable multiple template usages.

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* These documents summarizes work described at the 8^th International Conference on Nanoimprint and Nanoprint Technology in San Jose, CA, November 2009.


 NPS300
 UV-NIL
 Hot Embossing Lithography
 Nanoimprint Lithography

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