FC150
Automated Die Bonder

Abstract:
 The production of non-monolithic 3D-systems by stacking and interconnecting components through substrate vias (TSVs) is intrinsically limited to the stacking of thin dies, typically ranging from 100 μm down to 15 μm. Since dies or wafers of such thickness are no longer rigid, it is an important requirement that the bond guarantees mechanical stability and rigidity to the thin stacked die or wafer.

NB: The machine used to perform the application described in this paper is the FC150 from SET. As IMEC recently bought a FC300, all main 3D bonding applications will be performed in the future with the FC300.