SET to collaborate with IMEC on 3D integration research
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SET, Smart Equipment Technology, a leading supplier of high accuracy die-to-die (D2D) & die-to-wafer (D2W) bonders, will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institute, on the development of die pick-and-place and bonding processes for 3D chip integration, using SET’s FC300. IMEC’s 3D integration program explores 3D technology and design for application in various domains focusing on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects. |
The FC300 is a new generation of high accuracy (0.5 µm), high force (4,000 N) device bonder for wafers diameters up to 300 mm. It can be equipped with an optional built in chamber for collective reflow in a gas or vacuum environment. The FC300 also features nanoimprinting capabilities. The FC300 is able to perform various applications on the same platform with a quick process head reconfiguration:
high force bonding head, adapted to the thermo-compression bonding process especially interesting for Cu-Cu bonding applicable to 3D-ICs packaging it can also perform nanoimprint using hot embossing lithography process,
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“Previously involved in a JDP with IMEC, SET had developed oxide reduction capability in its bonder. Thanks to the expertise of the technical team at IMEC, SET is very confident that this new JDP will enable a good understanding of the 3D-IC integration requirements and their integration into the next generation of assembly tool”, said Gilbert Lecarpentier, Strategic Marketing Manager at SET. |
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Mass Reflow Process Chamber |
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About S.E.T.
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Die-to-Die, Die-to-Wafer Bonding and Nanoimprint Lithography solutions. With more than 250 Device Bonders installed worldwide, S.E.T. is globally renowned for the unsurpassed placement accuracy and the high flexibility of its Flip Chip bonders. From the KADETT semi-automated R&D Device Bonder, through the automated FC150 and FC300 to the production FC250, S.E.T. offers a continuous process path from research to production. S.E.T. bonders cover most bonding technologies and offer the unique ability to handle and bond both fragile and small components onto substrates up to 300 mm.
About IMEC
IMEC is a world-leading independent research center in nanoelectronics and nanotechnology. IMEC vzw is headquartered in Leuven, Belgium, has a sister company in the Netherlands, IMEC-NL, offices in the US, China and Taiwan, and representatives in Japan. Its staff of more than 1600 people includes more than 500 industrial residents and guest researchers. In 2007, its revenue (P&L) was EUR 244.5 million. IMEC’s More Moore research aims at semiconductor scaling towards sub-32nm nodes. With its More than Moore research, IMEC looks into technologies for nomadic embedded systems, wireless autonomous transducer solutions, biomedical electronics, photovoltaics, organic electronics and GaN power electronics. IMEC’s research bridges the gap between fundamental research at universities and technology development in industry. Its unique balance of processing and system know-how, intellectual property portfolio, state-of-the-art infrastructure and its strong network worldwide position IMEC as a key partner for shaping technologies for future systems. Further information on IMEC can be found on www.imec.be.
