ACCµRA M

The ACCμRA M is a manual flip-chip bonder that permits to align manually the components with a high level of precision.

It allows ± 3 μm accuracy.

The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process.

The ACCμRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities.

It is the perfect equipment for universities and R&D institutes.

Key Benefits

Small footprint

Manual machine

Easy to use

Open platform

R&D oriented

Technical Data

Click here to request the ACCµRA M Datasheet.

 

 

Process Capabilities

Thermocompression

Reflow

UV Curing

Au, Au/Sn, In, Cu

Applications

Flip-Chip, Die attach

C2C, C2S

Optoelectronics

Micro Assembly

MEMS, MOEMS, MCM