Quantum Computing

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Published by University of California and Google - 2017, November 30th

Qubit compatible superconducting interconnects

Toward a flip-chip bonder dedicated to direct bonding for production environment

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IWLPC October 24, 2017    SET, Saint-Jeoire, France

3D vertical integration of components is now an industrial reality. Considerations and results on direct bonding for HVM precise assembly are presented.
 

Results of the 2015 testbeam of 180 nm AMS High-Voltage CMOS sensor prototype

June 30, 2016专注于接合DPNC, University of Geneva, Switzerland下载

Active pixel sensors based on the High-Voltage CMOS technology are being investigated as a viable option for the future pixel tracker of the ATLAS experiment at the High-Luminosity LHC.

Evaluation of Sn-based Microbumping Technology for Hybrid IR Detectors, 10µm Pitch to 5µm Pitch

ECTC 2015专注于接合IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, France下载

Hybridization of Infrared detectors has relied on Indium balling for the last decades. Whereas this well-established process has proven its reliability through out the years, it becomes challenging to further decrease the balling pitch below 10µm, due to balling volume limitation.

Development done on Device Bonder to address 3D requirements in a Production Environment

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IWLPC 2014 focus on bonding SET, Saint-Jeoire, France

Key to the success of 3D integration will be the ability to accurately align and bond devices with aggressive feature sizes

Interconnect and bonding techniques for pixelated X-ray and gamma-ray detectors

7-12 September, 2014专注于接合UNIVERSITY OF SURREY, Guilford, Surrey, U.K.10th International Conference on Position Sensitive Detectors下载

In the last decade, the Detector Development at the Technology departmentof the Science and Technology Facilities Council (STFC), U.K., established a variety of fabrication and bonding techniques to build pixelated X-ray and y-ray detector systems such as the spectroscopic X-ray imaging detector HEXITEC.

Microbumping Technology for Hybrid IR detectors, 10µm pitch and beyond

EPTC 2014专注于接合IMEC Leuven, Belgium SOFRADIR Veurey-Voroize, FranceSingapore下载

In order to assess the feasability of a more mass-manufacturable process, IMEC has developed microbump technologies down to 10 µm pitch. The microbumps are based on Cu/Ni/Sn semi additive plating and built at wafer level using a process fully compatible with standard packaging infrastructures.

Development done on Device Bonder to address 3D requirements in a production environment

IWLPC 2014专注于接合SET Saint-Jeoire, FranceSan Jose, CA下载

This paper will explore the above challenges in 3D HVMand will present solutions and trade-offs using a systemslevel approach

Die Attach Bonding using High-frequency Ultrasonic Energy for High-temperature application

June 2014专注于接合IME - Journal of Electronics materials (abstract)下载

Room-temperature die-attach bonding using ultrasonic energy was evaluatedon Cu/In and Cu/Sn-3Ag metal stacks.

Wafer-level 3D integration with 5 micron interconnect pitch for infrared imaging applications

June 2014专注于接合RTI International下载

The use of 3D integration technology in focal plane array imaging devices has been shown to increase imagingcapability while simultaneously decreasing device area and power consumption, as compared to analogous 2D designs.

High Density Interconnect Bonding of Heterogeneous Materials Using Non-Collapsible Microbumps at 10 μm Pitch

June 2014专注于接合RTI International下载

This paper reports on a successful demonstration of the use and reliability of CU/SN interconnection of heterogeneous semiconductor die.

Chip to wafer copper direct bonding electrical characterization and thermal cycling

December 2013专注于接合CEA – LETI, MINATEC Campus下载

Study of the recent achievements in cooper direct bonding technology with oxide/cooper mixed surface.

Micro-tube insertion into aluminum pads: Simulation and experimental validations

IMAPS 2013专注于接合CEA – LETI, MINATEC Campus下载

Ultra-fine pitch flip-chip

9th International Conference and Exhibition on Device Packaging

This material is posted here with permission of IMAPS.

Aluminum to aluminum Bonding at Room Temperature

ECTC 2013专注于接合CEA – LETI, MINATEC Campus下载

High density and very lowpitches face to face aluminum/aluminum cold bonding is feasable when using aluminum coated micro-tubes inserted into aluminum pads.

Chip to wafer direct bonding technologies for high density 3D integration

ECTC 2012专注于接合CEA – LETI, MINATEC, STMicroelectronics, SET下载

Demonstration of chip to wafer assembly based on aligned Cu-Cu direct bonding.

A 10 μm Pitch Interconnection Technology using Micro Tube Insertion into Al-Cu for 3D Applications

ECTC 2011专注于接合CEA – LETI, MINATEC, LEM3 –CNRS/UPV-M下载

Future 3-D applications require a very low pitch for interstrata vertical interconnection. The last ITRS assessment for vertical interconnection predicts a need for...

This material is posted here with permission of IEEE.

Low-Profile 3D Silicon-on-Silicon Multi-chip Assembly

ECTC 2011专注于接合IBM T.J. Watson Research Center下载

The focus of this paper is multi-chip 3D silicon-on-silicon assembly using low-profile lead-free (Sn-Cu) solder interconnects.

This material is posted here with permission of IEEE.

Low Temperature Bonding of High Density Large Area Array Interconnects for 3D Integration

IMAPS 2010专注于接合RTI International下载

The results of bonding and stress testing of Cu/Sn-Cu bonded dice and Cu-Cu thermo-compression bonded dice....

This material is posted here with permission of Imaps.

Embedded active device packaging technology for real DDR2 memory chips

IWLPC 2010专注于接合Industrial Technology Research Institute (ITRI)下载

As high-speed, high-density, and high-performance are the primary IC development targets, packaging becomes key technology...

Originally published in the IWLPC Proceedings

Fabrication and performance of InAs/GaSb-based superlattice LWIR detectors

SPIE Defense, Sensing & Security 2010专注于接合HRL Laboratories下载

InAs/GaSb-based type II superlattices (T2SL) offer a manufacturable FPA technology with FPA size, scalability and cost advantages over HgCdTe.

Copyright 2010 SPIE

Ultrathin 3D ACA FlipChip-In-Flex Technology

ECTC 2010专注于接合Berlin Technical University, NB Technologies and Fraunhofer IZM下载

Die thickness of common, high-volume chip stacks range between 50-100 µm while thinning industry aims towards ultrathin...

This material is posted here with permission of IEEE.

Three Chips Stacking with Low Volume Solder Using Single Re-Flow Process

ECTC 2010专注于接合Institute of Microelectronics - A*STAR下载

A novel low temperature Cu-Cu bonding approach called the insertion bonding technique has been developed.

This material is posted here with permission of IEEE.

Insertion Bonding: A Novel Cu-Cu Bonding Approach for 3D Integration

ECTC 2010专注于接合IMEC and the Katholieke Universiteit Leuven下载

A novel low temperature Cu-Cu bonding approach called the insertion bonding technique has been developed.

This material is posted here with permission of IEEE.

SET Technical Bulletin N°3

February 2010专注于接合CEA-Leti, IMEC, ITRI, IME-A*Star, RTI, etc...下载

It is a compilation of articles written by our clients. Each article provides unique insights into the exciting area of C2W and C2C bonding.

RF MEMS and flip-chip for space flight demonstrator

June 2009专注于接合Thales Alenia Space下载

The next generation of telecommunication satellites payloads will require higher performances and higher..

Electrical characterization of high count, 10 µm pitch, room-temperature vertical interconnections

Device Packaging 2009专注于接合CEA-LETI下载

In order to increase the format of heterogeneous staring arrays to 2Kx2K pixels or even larger complexities, limited substrate size and cost...

This material is posted here with permission of Imaps.

New Reflow Soldering and Tip in Buried Box (TB2) Techniques For Ultrafine Pitch Megapixels Imaging Array

ECTC 2008专注于接合CEA-LETI下载

Flip chip is a high-density and highly reliable interconnection technology which is mandatory for the fabrication of high end imaging arrays.

This material is posted here with permission of IEEE.