Explore the World of Absolute Bonding Precision.
SET - Smart Equipment Technology, is the leading supplier of high accuracy Die-to-Die and Die-to-Wafer bonders.Device Bonder line
Do you need to buy a Die Bonder or a Flip Chip Bonder able to align and bond various type of components down to 0.5 µm post-bond accuracy?
Discover SET's bonders for Die Bonding, Pick & Place and Flip Chip Bonding :
FC300R, FC300, FC150, LDP150