NEO HB
With ± 1 µm post-bond accuracy in stand-alone or full automatic mode, the NEO HB is an automatic flip-chip bonder designed for production.
Combining high precision, flexibility and very short cycle time, it is pefectly suitable for hybrid / direct bonding processes (metal-to-metal or oxide-to-oxide), at room temperature and at low bonding force.
Key Benefits
Closed-loop systems to guarantee a high repeatability in operations
Ultra-high cleanliness - ISO 3
Compatible from stand alone to full automatic
User-friendly interface for multiple applications and processes
Applications
Hybrid / direct bonding (room temperature)
Flip-chip bonding, die bonding
Chip-to-wafer, wafer level applications
Chip-to-substrate bonding
Pick & Place
Memory stacking
3D IC